Course No: MTEC.4840-061; SIS Class Nbr: 1354; SIS Term: 2840
Course Status: Open
This course introduces the user to the principles of Pro/ENGINEER, solid modeling, and parametric design. It is a hands-on project and exercise-based course. Topics will include: feature-based parametric solid modeling, pick and place features, sketched features, the basics of creating parts and assemblies, and drawing creation. Advanced topics will include 3-D sweeps, helical sweeps, and blends
Prerequisites, Notes & Instructor
- Special Notes:
- Section Notes:
- Core Codes: STEM
- Credits: 3; Contact Hours: 3
When Offered & Tuition
- Summer 2019: May 20 to Jul 28
- Course Level: Undergraduate
- Tuition: $1140
- Note: There is a $30 per semester, nonrefundable registration fee for credit courses.
Friday Class Meetings for On Campus / Face-to-Face Courses
Summer I Mon/Wed Evening Courses: Meet May 20-July 1 and include 3 FRIDAYS: May 24, June 7 and June 21 at the regularly scheduled hours.
Summer I Tues/Thurs Evening Courses: Meet May 21-July 1 include 2 FRIDAYS: May 31 and June 14 at the regularly scheduled hours.
Summer II Mon/Wed Evening Courses: Meet July 8 to Aug 15 include 2 FRIDAYS: July 12, July 26 at the regularly scheduled hours.
Summer II Tues/Thurs Evening Courses: Meet July 9 to Aug 15 include 2 FRIDAYS: July 19 and August 12 at the regularly scheduled hours.
Related Programs: B.S. in Information Technology, B.S. in Mechanical Engineering Technology, Certificate in Computer Assisted Manufacturing
Every effort has been made to ensure the accuracy of the information presented in this catalog. However, the Division of Online & Continuing Education reserves the right to implement new rules and regulations and to make changes of any nature to its program, calendar, procedures, standards, degree requirements, academic schedules (including, without limitations, changes in course content and class schedules), locations, tuition and fees. Whenever possible, appropriate notice of such changes will be given before they become effective.